| WHAT
WE DO: |
| ExcelTech
is a multi-service assembly business, concentrating on printed
circuit board assembly. Our long-time customers include industry
leaders in avionics, display technology, semiconductors, communications,
test & measurement, motion controllers, marine navigation, integrated
circuits, and networking among others. Our capabilities include: |
|
| IN-CIRCUIT
TEST: |
| SPEA 4040
FIXTURELESS IN-CIRCUIT TESTER |
|
|
| SURFACE
MOUNT TECHNOLOGY (SMT): |
|
| SMT
PASTE PRINTERS |
|
EKRA X4 |
| |
MPM
AP-24 |
| |
|
Vision
alignment |
| |
|
2D
print inspection |
| |
|
Maximum
frame size 29" x 29" |
|
| PICK
AND PLACE |
| |
Assembleon
Emerald X |
| |
Assembleon
Topaz X |
| |
|
CSP,
mBGA, BGA, and 0201 capable |
| |
|
18000
CPH |
| |
|
.3
mm minimum pitch |
| |
|
54mm2
max device size |
|
| BGA/CSP
PLACEMENT/REWORK STATION |
| |
OK
Industries BGA Micro Oven 3500 |
| |
|
Computer
controlled, real time thermal profiling |
| |
|
Vision
Alignment of component to PCB |
| |
|
BGA,
mBGA, CSP, Fine Pitch |
|
|
| REFLOW
OVEN |
|
Heller
1700 EXL |
| |
|
Type:
Convection |
| |
|
KIC
thermal profiling |
| |
|
Conveyor
or mesh belt |
| |
|
Zones:
6 heat and 1 cool |
|
| |
Vitronics
SMD 3118 |
| |
|
Type:
Infrared |
| |
|
Mesh
belt |
| |
|
Zones:
5 heat and 1 cool |
|
| Maximum
Board Size: 24" x 17" |
|
 |
|
|
| THRU
HOLE: |
|
| WAVE
SOLDER |
| |
Electrovert
445 |
| |
|
Lambda
wave |
| |
|
Agitator |
| |
Electrovert 650C |
| |
|
Lambda
wave |
| |
|
Chip wave |
|
| SOLDER
POT |
| |
Air-Vac |
|
| COMPONENT
FORMING |
| |
MMI
ADP100 |
| |
Hepco
1500 |
| |
Hepco
3000 |
| |
Hepco 7600C |
| |
Hepco
8000 |
| |
Simonds
CLP-274 |
| |
Mark
V (3) |
|
| OTHER
EQUIPMENT: |
|
| X-RAY
|
|
Glenbrook
RTX 113 |
| |
|
Variable
angle, printable image available |
|
| IN-LINE
WASHER |
| |
Westkleen
Formula II Aqueous Cleaning |
| |
|
24"
maximum board width |
| |
|
Closed
loop filtration |
| |
|
De-ionized
water |
|
| DE-PANELIZER |
| |
BJZ
NTG-4A |
|
| BATCH
WASHER |
| |
ECD |
|
| VARIOUS
DMM'S |
|
| OSCILLOSCOPE |
|
| POWER
SUPPLIES |
|
| MICROSCOPES |
|
|
| OUR
WORKFORCE: |
|
| Procedure
Manuals used by all Assembly Staff |
|
| Color-coded
work instructions |
|
| Configuration
control over all work instructions and procedures |
|
| ESD
program in place |
|
| CURRENT
WORKMANSHIP TRAINING REQUIREMENTS |
|
IPC-A-610(C) |
| |
Past
workmanship training requirements: |
| |
MIL-STD-454 |
| |
MIL-STD-2000 |
| |
MIL-STD-2000A |
|
| OUR
TECHNICAL FOCUS: |
| Surface
Mount and Through Hole needs; including CSP, BGA, MicroBGA,
and Fine Pitch (.3mm) |
|
|
|
|
